SiP System-in-Package Design and Simulation

Mentor EE Flow Advanced Design Guide
Product Number: EB00709246
Released: Aug 03, 2017
Business Term: Purchase
ISBN: #9781119046004
Publisher: Wiley
Please log in to view pricing


An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: -Cavity and sacked dies design -FlipChip and RDL design -Routing and coppering -3D Real-Time DRC check -SiP simulation technology -Mentor SiP Design and Simulation Platform Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.

Author(s): Suny Li
Genre: Science
Original Publish Date: Jul 14, 2017

Sign up for our email newsletter