3D IC and RF SiPs

Advanced Stacking and Planar Solutions for 5G Mobility
Genre: Science
Original Publish Date: Mar 29, 2018
Product Number: EB00723939
Released: Apr 19, 2018
Business Term: Purchase
ISBN: #9781119289661
Publisher: Wiley-IEEE Press
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An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments -Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility -Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft's Excel and Minitab -Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail -Provides chapter-wise review questions and powerpoint slides as teaching tools

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